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Grade M30H Nickel vs. C10500 Copper

Grade M30H nickel belongs to the nickel alloys classification, while C10500 copper belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is C10500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 11
2.8 to 51
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 61
43
Tensile Strength: Ultimate (UTS), MPa 770
220 to 400
Tensile Strength: Yield (Proof), MPa 470
75 to 400

Thermal Properties

Latent Heat of Fusion, J/g 320
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1250
1080
Melting Onset (Solidus), °C 1200
1080
Specific Heat Capacity, J/kg-K 440
390
Thermal Conductivity, W/m-K 22
390
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
100
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
100

Otherwise Unclassified Properties

Base Metal Price, % relative 50
32
Density, g/cm3 8.6
9.0
Embodied Carbon, kg CO2/kg material 7.7
2.6
Embodied Energy, MJ/kg 110
42
Embodied Water, L/kg 250
350

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 75
11 to 90
Resilience: Unit (Modulus of Resilience), kJ/m3 700
24 to 680
Stiffness to Weight: Axial, points 10
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 25
6.8 to 12
Strength to Weight: Bending, points 22
9.1 to 14
Thermal Diffusivity, mm2/s 5.7
110
Thermal Shock Resistance, points 27
7.8 to 14

Alloy Composition

Carbon (C), % 0 to 0.3
0
Copper (Cu), % 27 to 33
99.89 to 99.966
Iron (Fe), % 0 to 3.5
0
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 57.9 to 70.3
0
Oxygen (O), % 0
0 to 0.0010
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 2.7 to 3.7
0
Silver (Ag), % 0
0.034 to 0.060
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.050