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Grade M30H Nickel vs. C14700 Copper

Grade M30H nickel belongs to the nickel alloys classification, while C14700 copper belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is C14700 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 11
9.1 to 35
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 61
43
Tensile Strength: Ultimate (UTS), MPa 770
240 to 320
Tensile Strength: Yield (Proof), MPa 470
85 to 250

Thermal Properties

Latent Heat of Fusion, J/g 320
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1250
1080
Melting Onset (Solidus), °C 1200
1070
Specific Heat Capacity, J/kg-K 440
390
Thermal Conductivity, W/m-K 22
370
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
95
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
96

Otherwise Unclassified Properties

Base Metal Price, % relative 50
30
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 7.7
2.6
Embodied Energy, MJ/kg 110
41
Embodied Water, L/kg 250
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 75
25 to 65
Resilience: Unit (Modulus of Resilience), kJ/m3 700
31 to 280
Stiffness to Weight: Axial, points 10
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 25
7.3 to 10
Strength to Weight: Bending, points 22
9.5 to 12
Thermal Diffusivity, mm2/s 5.7
110
Thermal Shock Resistance, points 27
8.4 to 12

Alloy Composition

Carbon (C), % 0 to 0.3
0
Copper (Cu), % 27 to 33
99.395 to 99.798
Iron (Fe), % 0 to 3.5
0
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 57.9 to 70.3
0
Phosphorus (P), % 0 to 0.030
0.0020 to 0.0050
Silicon (Si), % 2.7 to 3.7
0
Sulfur (S), % 0 to 0.030
0.2 to 0.5
Residuals, % 0
0 to 0.1