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Grade M35-2 Nickel vs. C96300 Copper-nickel

Grade M35-2 nickel belongs to the nickel alloys classification, while C96300 copper-nickel belongs to the copper alloys. They have 52% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is grade M35-2 nickel and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
130
Elongation at Break, % 28
11
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 62
49
Tensile Strength: Ultimate (UTS), MPa 500
580
Tensile Strength: Yield (Proof), MPa 230
430

Thermal Properties

Latent Heat of Fusion, J/g 280
230
Maximum Temperature: Mechanical, °C 900
240
Melting Completion (Liquidus), °C 1280
1200
Melting Onset (Solidus), °C 1230
1150
Specific Heat Capacity, J/kg-K 430
400
Thermal Conductivity, W/m-K 22
37
Thermal Expansion, µm/m-K 13
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 55
42
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 8.1
5.1
Embodied Energy, MJ/kg 110
76
Embodied Water, L/kg 250
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
59
Resilience: Unit (Modulus of Resilience), kJ/m3 170
720
Stiffness to Weight: Axial, points 10
8.2
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 16
18
Strength to Weight: Bending, points 16
17
Thermal Diffusivity, mm2/s 5.7
10
Thermal Shock Resistance, points 17
20

Alloy Composition

Carbon (C), % 0 to 0.35
0 to 0.15
Copper (Cu), % 26 to 33
72.3 to 80.8
Iron (Fe), % 0 to 3.5
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 1.5
0.25 to 1.5
Nickel (Ni), % 59.1 to 74
18 to 22
Niobium (Nb), % 0 to 0.5
0.5 to 1.5
Phosphorus (P), % 0 to 0.030
0 to 0.020
Silicon (Si), % 0 to 2.0
0 to 0.5
Sulfur (S), % 0 to 0.030
0 to 0.020
Residuals, % 0
0 to 0.5