Grade TDC Steel vs. C17200 Copper
Grade TDC steel belongs to the iron alloys classification, while C17200 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is grade TDC steel and the bottom bar is C17200 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 190 | |
| 120 |
| Poisson's Ratio | 0.29 | |
| 0.33 |
| Shear Modulus, GPa | 80 | |
| 45 |
| Tensile Strength: Ultimate (UTS), MPa | 1700 | |
| 480 to 1380 |
Thermal Properties
| Latent Heat of Fusion, J/g | 250 | |
| 230 |
| Maximum Temperature: Mechanical, °C | 400 | |
| 280 |
| Melting Completion (Liquidus), °C | 1450 | |
| 980 |
| Melting Onset (Solidus), °C | 1410 | |
| 870 |
| Specific Heat Capacity, J/kg-K | 470 | |
| 390 |
| Thermal Conductivity, W/m-K | 51 | |
| 110 |
| Thermal Expansion, µm/m-K | 13 | |
| 18 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 7.1 | |
| 22 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 8.2 | |
| 23 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.8 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 1.4 | |
| 9.4 |
| Embodied Energy, MJ/kg | 19 | |
| 150 |
| Embodied Water, L/kg | 47 | |
| 310 |
Common Calculations
| Stiffness to Weight: Axial, points | 13 | |
| 7.6 |
| Stiffness to Weight: Bending, points | 24 | |
| 19 |
| Strength to Weight: Axial, points | 60 | |
| 15 to 44 |
| Strength to Weight: Bending, points | 40 | |
| 16 to 31 |
| Thermal Diffusivity, mm2/s | 14 | |
| 31 |
| Thermal Shock Resistance, points | 50 | |
| 16 to 46 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0 to 0.2 |
| Beryllium (Be), % | 0 | |
| 1.8 to 2.0 |
| Carbon (C), % | 0.6 to 0.75 | |
| 0 |
| Chromium (Cr), % | 0 to 0.3 | |
| 0 |
| Copper (Cu), % | 0 to 0.1 | |
| 96.1 to 98 |
| Iron (Fe), % | 98 to 99.4 | |
| 0 to 0.4 |
| Manganese (Mn), % | 0.5 to 1.2 | |
| 0 |
| Nickel (Ni), % | 0 | |
| 0.2 to 0.6 |
| Phosphorus (P), % | 0 to 0.020 | |
| 0 |
| Silicon (Si), % | 0.1 to 0.35 | |
| 0 to 0.2 |
| Sulfur (S), % | 0 to 0.020 | |
| 0 |
| Residuals, % | 0 | |
| 0 to 0.5 |