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H02 C19700 Copper vs. H02 C69300 Brass

Both H02 C19700 copper and H02 C69300 brass are copper alloys. Both are furnished in the H02 (half hard) temper. They have 76% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is H02 C19700 copper and the bottom bar is H02 C69300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 13
8.5
Poisson's Ratio 0.34
0.32
Rockwell B Hardness 67
88
Shear Modulus, GPa 43
41
Shear Strength, MPa 240
370
Tensile Strength: Ultimate (UTS), MPa 400
630
Tensile Strength: Yield (Proof), MPa 330
390

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
160
Melting Completion (Liquidus), °C 1090
880
Melting Onset (Solidus), °C 1040
860
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 250
38
Thermal Expansion, µm/m-K 17
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 88
8.0
Electrical Conductivity: Equal Weight (Specific), % IACS 89
8.8

Otherwise Unclassified Properties

Base Metal Price, % relative 30
26
Density, g/cm3 8.9
8.2
Embodied Carbon, kg CO2/kg material 2.6
2.7
Embodied Energy, MJ/kg 41
45
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49
47
Resilience: Unit (Modulus of Resilience), kJ/m3 460
700
Stiffness to Weight: Axial, points 7.2
7.4
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 12
21
Strength to Weight: Bending, points 14
20
Thermal Diffusivity, mm2/s 73
12
Thermal Shock Resistance, points 14
22

Alloy Composition

Cobalt (Co), % 0 to 0.050
0
Copper (Cu), % 97.4 to 99.59
73 to 77
Iron (Fe), % 0.3 to 1.2
0 to 0.1
Lead (Pb), % 0 to 0.050
0 to 0.090
Magnesium (Mg), % 0.010 to 0.2
0
Manganese (Mn), % 0 to 0.050
0 to 0.1
Nickel (Ni), % 0 to 0.050
0 to 0.1
Phosphorus (P), % 0.1 to 0.4
0.040 to 0.15
Silicon (Si), % 0
2.7 to 3.4
Tin (Sn), % 0 to 0.2
0 to 0.2
Zinc (Zn), % 0 to 0.2
18.4 to 24.3
Residuals, % 0
0 to 0.5