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H02 C49300 Brass vs. H02 C70600 Copper-nickel

Both H02 C49300 brass and H02 C70600 copper-nickel are copper alloys. Both are furnished in the H02 (half hard) temper. They have 62% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is H02 C49300 brass and the bottom bar is H02 C70600 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 9.0
8.0
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
46
Shear Strength, MPa 270
270
Tensile Strength: Ultimate (UTS), MPa 460
460
Tensile Strength: Yield (Proof), MPa 410
63

Thermal Properties

Latent Heat of Fusion, J/g 170
220
Maximum Temperature: Mechanical, °C 120
220
Melting Completion (Liquidus), °C 880
1150
Melting Onset (Solidus), °C 840
1100
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 88
44
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 17
9.9

Otherwise Unclassified Properties

Base Metal Price, % relative 26
33
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 3.0
3.4
Embodied Energy, MJ/kg 50
51
Embodied Water, L/kg 370
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40
26
Resilience: Unit (Modulus of Resilience), kJ/m3 800
16
Stiffness to Weight: Axial, points 7.2
7.7
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 16
14
Strength to Weight: Bending, points 17
15
Thermal Diffusivity, mm2/s 29
13
Thermal Shock Resistance, points 16
15

Alloy Composition

Aluminum (Al), % 0 to 0.5
0
Antimony (Sb), % 0 to 0.5
0
Bismuth (Bi), % 0.5 to 2.0
0
Copper (Cu), % 58 to 62
84.7 to 90
Iron (Fe), % 0 to 0.1
1.0 to 1.8
Lead (Pb), % 0 to 0.010
0 to 0.050
Manganese (Mn), % 0 to 0.030
0 to 1.0
Nickel (Ni), % 0 to 1.5
9.0 to 11
Phosphorus (P), % 0 to 0.2
0
Selenium (Se), % 0 to 0.2
0
Silicon (Si), % 0 to 0.1
0
Tin (Sn), % 1.0 to 1.8
0
Zinc (Zn), % 30.6 to 40.5
0 to 1.0
Residuals, % 0
0 to 0.5