H02 C69300 Brass vs. H02 C72500 Copper-nickel
Both H02 C69300 brass and H02 C72500 copper-nickel are copper alloys. Both are furnished in the H02 (half hard) temper. They have 76% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.
For each property being compared, the top bar is H02 C69300 brass and the bottom bar is H02 C72500 copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 120 |
| Poisson's Ratio | 0.32 | |
| 0.34 |
| Rockwell B Hardness | 88 | |
| 80 |
| Shear Modulus, GPa | 41 | |
| 45 |
| Tensile Strength: Ultimate (UTS), MPa | 630 | |
| 500 |
Thermal Properties
| Latent Heat of Fusion, J/g | 240 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 160 | |
| 210 |
| Melting Completion (Liquidus), °C | 880 | |
| 1130 |
| Melting Onset (Solidus), °C | 860 | |
| 1060 |
| Specific Heat Capacity, J/kg-K | 400 | |
| 390 |
| Thermal Conductivity, W/m-K | 38 | |
| 54 |
| Thermal Expansion, µm/m-K | 19 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 8.0 | |
| 11 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 8.8 | |
| 11 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 26 | |
| 35 |
| Density, g/cm3 | 8.2 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 2.7 | |
| 3.6 |
| Embodied Energy, MJ/kg | 45 | |
| 55 |
| Embodied Water, L/kg | 310 | |
| 320 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.4 | |
| 7.6 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 21 | |
| 16 |
| Strength to Weight: Bending, points | 20 | |
| 16 |
| Thermal Diffusivity, mm2/s | 12 | |
| 16 |
| Thermal Shock Resistance, points | 22 | |
| 17 |
Alloy Composition
| Copper (Cu), % | 73 to 77 | |
| 85.2 to 89.7 |
| Iron (Fe), % | 0 to 0.1 | |
| 0 to 0.6 |
| Lead (Pb), % | 0 to 0.090 | |
| 0 to 0.050 |
| Manganese (Mn), % | 0 to 0.1 | |
| 0 to 0.2 |
| Nickel (Ni), % | 0 to 0.1 | |
| 8.5 to 10.5 |
| Phosphorus (P), % | 0.040 to 0.15 | |
| 0 |
| Silicon (Si), % | 2.7 to 3.4 | |
| 0 |
| Tin (Sn), % | 0 to 0.2 | |
| 1.8 to 2.8 |
| Zinc (Zn), % | 18.4 to 24.3 | |
| 0 to 0.5 |
| Residuals, % | 0 | |
| 0 to 0.2 |