Solder Alloy 103 vs. R60802 Alloy
Both solder alloy 103 and R60802 alloy are otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is solder alloy 103 and the bottom bar is R60802 alloy.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 37 | |
98 |
Elongation at Break, % | 47 | |
22 |
Poisson's Ratio | 0.39 | |
0.34 |
Shear Modulus, GPa | 13 | |
36 |
Tensile Strength: Ultimate (UTS), MPa | 52 | |
430 |
Thermal Properties
Latent Heat of Fusion, J/g | 45 | |
250 |
Specific Heat Capacity, J/kg-K | 180 | |
270 |
Thermal Conductivity, W/m-K | 50 | |
22 |
Thermal Expansion, µm/m-K | 24 | |
6.0 |
Otherwise Unclassified Properties
Density, g/cm3 | 8.9 | |
6.5 |
Embodied Water, L/kg | 910 | |
290 |
Common Calculations
Stiffness to Weight: Axial, points | 2.3 | |
8.3 |
Stiffness to Weight: Bending, points | 12 | |
23 |
Strength to Weight: Axial, points | 1.6 | |
18 |
Strength to Weight: Bending, points | 3.5 | |
19 |
Thermal Diffusivity, mm2/s | 30 | |
12 |
Thermal Shock Resistance, points | 4.3 | |
53 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 |
Antimony (Sb), % | 0 to 0.2 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.1 | |
0 |
Cadmium (Cd), % | 0 to 0.0020 | |
0 |
Chromium (Cr), % | 0 | |
0.050 to 0.15 |
Copper (Cu), % | 0 to 0.080 | |
0 |
Gold (Au), % | 0 to 0.050 | |
0 |
Indium (In), % | 0 to 0.1 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0.070 to 0.2 |
Lead (Pb), % | 38.8 to 40.5 | |
0 |
Nickel (Ni), % | 0 to 0.010 | |
0.030 to 0.080 |
Silver (Ag), % | 0 to 0.1 | |
0 |
Tin (Sn), % | 59.5 to 60.5 | |
1.2 to 1.7 |
Zinc (Zn), % | 0 to 0.0010 | |
0 |
Zirconium (Zr), % | 0 | |
97.8 to 98.7 |
Residuals, % | 0 | |
0 to 0.11 |