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Solder Alloy 111 vs. C15500 Copper

Solder alloy 111 belongs to the otherwise unclassified metals classification, while C15500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 111 and the bottom bar is C15500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 33
120
Elongation at Break, % 35
3.0 to 37
Poisson's Ratio 0.4
0.34
Shear Modulus, GPa 12
43
Tensile Strength: Ultimate (UTS), MPa 41
280 to 550

Thermal Properties

Latent Heat of Fusion, J/g 41
210
Melting Completion (Liquidus), °C 220
1080
Melting Onset (Solidus), °C 180
1080
Specific Heat Capacity, J/kg-K 180
390
Thermal Conductivity, W/m-K 48
350
Thermal Expansion, µm/m-K 26
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
90
Electrical Conductivity: Equal Weight (Specific), % IACS 11
91

Otherwise Unclassified Properties

Density, g/cm3 9.3
8.9
Embodied Carbon, kg CO2/kg material 9.4
2.7
Embodied Energy, MJ/kg 160
42
Embodied Water, L/kg 830
360

Common Calculations

Stiffness to Weight: Axial, points 2.0
7.2
Stiffness to Weight: Bending, points 12
18
Strength to Weight: Axial, points 1.2
8.6 to 17
Strength to Weight: Bending, points 2.8
11 to 17
Thermal Diffusivity, mm2/s 29
100
Thermal Shock Resistance, points 3.5
9.8 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
99.75 to 99.853
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 48.8 to 50.5
0
Magnesium (Mg), % 0
0.080 to 0.13
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0.040 to 0.080
Silver (Ag), % 0 to 0.1
0.027 to 0.1
Tin (Sn), % 49.5 to 50.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.2