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Solder Alloy 111 vs. C72150 Copper-nickel

Solder alloy 111 belongs to the otherwise unclassified metals classification, while C72150 copper-nickel belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 111 and the bottom bar is C72150 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
99
Elastic (Young's, Tensile) Modulus, GPa 33
150
Elongation at Break, % 35
29
Poisson's Ratio 0.4
0.33
Shear Modulus, GPa 12
55
Tensile Strength: Ultimate (UTS), MPa 41
490

Thermal Properties

Latent Heat of Fusion, J/g 41
250
Melting Completion (Liquidus), °C 220
1210
Melting Onset (Solidus), °C 180
1250
Specific Heat Capacity, J/kg-K 180
410
Thermal Conductivity, W/m-K 48
22
Thermal Expansion, µm/m-K 26
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
3.5
Electrical Conductivity: Equal Weight (Specific), % IACS 11
3.6

Otherwise Unclassified Properties

Density, g/cm3 9.3
8.9
Embodied Carbon, kg CO2/kg material 9.4
6.1
Embodied Energy, MJ/kg 160
88
Embodied Water, L/kg 830
270

Common Calculations

Stiffness to Weight: Axial, points 2.0
9.1
Stiffness to Weight: Bending, points 12
20
Strength to Weight: Axial, points 1.2
15
Strength to Weight: Bending, points 2.8
15
Thermal Diffusivity, mm2/s 29
6.0
Thermal Shock Resistance, points 3.5
18

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 0 to 0.080
52.5 to 57
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 48.8 to 50.5
0 to 0.050
Manganese (Mn), % 0
0 to 0.050
Nickel (Ni), % 0 to 0.010
43 to 46
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 49.5 to 50.5
0
Zinc (Zn), % 0 to 0.0010
0 to 0.2
Residuals, % 0
0 to 0.5