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Solder Alloy 113 vs. Solder Alloy 601

Both solder alloy 113 and solder alloy 601 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 45% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
31
Elongation at Break, % 32
83
Poisson's Ratio 0.4
0.41
Shear Modulus, GPa 11
11
Tensile Strength: Ultimate (UTS), MPa 39
12

Thermal Properties

Latent Heat of Fusion, J/g 40
43
Melting Completion (Liquidus), °C 230
120
Melting Onset (Solidus), °C 180
120
Specific Heat Capacity, J/kg-K 170
230
Thermal Conductivity, W/m-K 46
34
Thermal Expansion, µm/m-K 26
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
12
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
14

Otherwise Unclassified Properties

Density, g/cm3 9.5
7.3
Embodied Water, L/kg 800
1330

Common Calculations

Stiffness to Weight: Axial, points 1.8
2.3
Stiffness to Weight: Bending, points 11
14
Strength to Weight: Axial, points 1.1
0.45
Strength to Weight: Bending, points 2.7
1.6
Thermal Diffusivity, mm2/s 28
20
Thermal Shock Resistance, points 3.4
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.1
Cadmium (Cd), % 0 to 0.0050
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
51 to 52.5
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 53.4 to 55.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 44.5 to 45.5
47.5 to 48.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010