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Solder Alloy 113 vs. C70250 Copper

Solder alloy 113 belongs to the otherwise unclassified metals classification, while C70250 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is C70250 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
120
Poisson's Ratio 0.4
0.34
Shear Modulus, GPa 11
44
Tensile Strength: Ultimate (UTS), MPa 39
520 to 740

Thermal Properties

Latent Heat of Fusion, J/g 40
220
Melting Completion (Liquidus), °C 230
1100
Melting Onset (Solidus), °C 180
1080
Specific Heat Capacity, J/kg-K 170
390
Thermal Conductivity, W/m-K 46
170
Thermal Expansion, µm/m-K 26
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
36 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
37 to 51

Otherwise Unclassified Properties

Density, g/cm3 9.5
8.9
Embodied Carbon, kg CO2/kg material 8.9
2.9
Embodied Energy, MJ/kg 150
45
Embodied Water, L/kg 800
310

Common Calculations

Stiffness to Weight: Axial, points 1.8
7.4
Stiffness to Weight: Bending, points 11
18
Strength to Weight: Axial, points 1.1
16 to 23
Strength to Weight: Bending, points 2.7
16 to 21
Thermal Diffusivity, mm2/s 28
49
Thermal Shock Resistance, points 3.4
18 to 26

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
92.7 to 97.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 53.4 to 55.5
0 to 0.050
Magnesium (Mg), % 0
0.050 to 0.3
Manganese (Mn), % 0
0 to 0.1
Nickel (Ni), % 0 to 0.010
2.2 to 4.2
Silicon (Si), % 0
0.25 to 1.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 44.5 to 45.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5