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Solder Alloy 114 vs. Solder Alloy 117

Both solder alloy 114 and solder alloy 117 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 80% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 114 and the bottom bar is solder alloy 117.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
11
Elastic (Young's, Tensile) Modulus, GPa 30
23
Elongation at Break, % 25
20
Poisson's Ratio 0.41
0.42
Shear Modulus, GPa 11
8.1
Tensile Strength: Ultimate (UTS), MPa 37
33

Thermal Properties

Latent Heat of Fusion, J/g 38
31
Melting Completion (Liquidus), °C 240
280
Melting Onset (Solidus), °C 180
180
Specific Heat Capacity, J/kg-K 170
150
Thermal Conductivity, W/m-K 44
37
Thermal Expansion, µm/m-K 26
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
8.7
Electrical Conductivity: Equal Weight (Specific), % IACS 9.4
7.5

Otherwise Unclassified Properties

Base Metal Price, % relative 95
85
Density, g/cm3 9.7
11
Embodied Carbon, kg CO2/kg material 8.3
6.1
Embodied Energy, MJ/kg 140
100
Embodied Water, L/kg 760
610

Common Calculations

Stiffness to Weight: Axial, points 1.7
1.2
Stiffness to Weight: Bending, points 11
9.0
Strength to Weight: Axial, points 1.1
0.88
Strength to Weight: Bending, points 2.6
2.2
Thermal Diffusivity, mm2/s 27
24
Thermal Shock Resistance, points 3.4
3.7

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 58.4 to 60.5
78.4 to 80.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 39.5 to 40.5
19.5 to 20.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010