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Solder Alloy 114 vs. Solder Alloy 123

Both solder alloy 114 and solder alloy 123 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 65% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 114 and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
8.0
Elastic (Young's, Tensile) Modulus, GPa 30
18
Elongation at Break, % 25
45
Poisson's Ratio 0.41
0.44
Shear Modulus, GPa 11
6.2
Tensile Strength: Ultimate (UTS), MPa 37
28

Thermal Properties

Latent Heat of Fusion, J/g 38
26
Melting Completion (Liquidus), °C 240
310
Melting Onset (Solidus), °C 180
300
Specific Heat Capacity, J/kg-K 170
130
Thermal Conductivity, W/m-K 44
23
Thermal Expansion, µm/m-K 26
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 9.4
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 95
75
Density, g/cm3 9.7
11
Embodied Carbon, kg CO2/kg material 8.3
4.5
Embodied Energy, MJ/kg 140
74
Embodied Water, L/kg 760
500

Common Calculations

Stiffness to Weight: Axial, points 1.7
0.9
Stiffness to Weight: Bending, points 11
7.8
Strength to Weight: Axial, points 1.1
0.69
Strength to Weight: Bending, points 2.6
1.8
Thermal Diffusivity, mm2/s 27
16
Thermal Shock Resistance, points 3.4
3.8

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.1
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 58.4 to 60.5
93.5 to 95.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 39.5 to 40.5
4.5 to 5.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010