Solder Alloy 115 vs. ASTM B780 Alloy
Both solder alloy 115 and ASTM B780 alloy are otherwise unclassified metals. There are 16 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.
For each property being compared, the top bar is solder alloy 115 and the bottom bar is ASTM B780 alloy.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 28 | |
83 |
Elongation at Break, % | 22 | |
1.1 to 9.1 |
Poisson's Ratio | 0.41 | |
0.36 |
Shear Modulus, GPa | 10 | |
30 |
Tensile Strength: Ultimate (UTS), MPa | 36 | |
330 to 590 |
Thermal Properties
Latent Heat of Fusion, J/g | 36 | |
140 |
Specific Heat Capacity, J/kg-K | 160 | |
270 |
Thermal Expansion, µm/m-K | 27 | |
18 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 9.8 | |
70 to 76 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 8.9 | |
62 to 68 |
Otherwise Unclassified Properties
Density, g/cm3 | 9.9 | |
10 |
Common Calculations
Stiffness to Weight: Axial, points | 1.6 | |
4.5 |
Stiffness to Weight: Bending, points | 10 | |
14 |
Strength to Weight: Axial, points | 1.0 | |
9.1 to 16 |
Strength to Weight: Bending, points | 2.4 | |
11 to 15 |
Thermal Shock Resistance, points | 3.4 | |
16 to 29 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 |
Antimony (Sb), % | 0 to 0.5 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.25 | |
0 |
Cadmium (Cd), % | 0 to 0.0050 | |
0 to 0.050 |
Copper (Cu), % | 0 to 0.080 | |
23.5 to 25.7 |
Gold (Au), % | 0 to 0.050 | |
0 |
Indium (In), % | 0 to 0.1 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0 to 0.050 |
Lead (Pb), % | 63.4 to 65.5 | |
0 to 0.030 |
Nickel (Ni), % | 0 to 0.010 | |
0.35 to 0.65 |
Silver (Ag), % | 0 to 0.1 | |
74 to 76 |
Tin (Sn), % | 34.5 to 35.5 | |
0 |
Zinc (Zn), % | 0 to 0.0010 | |
0 to 0.060 |