Solder Alloy 115 vs. Solder Alloy 136
Both solder alloy 115 and solder alloy 136 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a moderately high 90% of their average alloy composition in common. There are 24 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.
For each property being compared, the top bar is solder alloy 115 and the bottom bar is solder alloy 136.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 28 | |
| 25 |
| Elongation at Break, % | 22 | |
| 19 |
| Poisson's Ratio | 0.41 | |
| 0.42 |
| Shear Modulus, GPa | 10 | |
| 8.9 |
| Tensile Strength: Ultimate (UTS), MPa | 36 | |
| 34 |
Thermal Properties
| Latent Heat of Fusion, J/g | 36 | |
| 34 |
| Melting Completion (Liquidus), °C | 250 | |
| 260 |
| Melting Onset (Solidus), °C | 180 | |
| 190 |
| Specific Heat Capacity, J/kg-K | 160 | |
| 150 |
| Thermal Conductivity, W/m-K | 43 | |
| 40 |
| Thermal Expansion, µm/m-K | 27 | |
| 27 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 9.8 | |
| 9.2 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 8.9 | |
| 8.0 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 95 | |
| 90 |
| Density, g/cm3 | 9.9 | |
| 10 |
| Embodied Carbon, kg CO2/kg material | 7.8 | |
| 6.8 |
| Embodied Energy, MJ/kg | 130 | |
| 110 |
| Embodied Water, L/kg | 730 | |
| 680 |
Common Calculations
| Stiffness to Weight: Axial, points | 1.6 | |
| 1.4 |
| Stiffness to Weight: Bending, points | 10 | |
| 9.5 |
| Strength to Weight: Axial, points | 1.0 | |
| 0.92 |
| Strength to Weight: Bending, points | 2.4 | |
| 2.3 |
| Thermal Diffusivity, mm2/s | 27 | |
| 26 |
| Thermal Shock Resistance, points | 3.4 | |
| 3.6 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 to 0.5 | |
| 0.5 to 2.0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0 to 0.25 | |
| 0 to 0.25 |
| Cadmium (Cd), % | 0 to 0.0050 | |
| 0 to 0.0050 |
| Copper (Cu), % | 0 to 0.080 | |
| 0 to 0.080 |
| Gold (Au), % | 0 to 0.050 | |
| 0 to 0.050 |
| Indium (In), % | 0 to 0.1 | |
| 0 to 0.1 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.020 |
| Lead (Pb), % | 63.4 to 65.5 | |
| 71.9 to 75 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 to 0.010 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 to 0.1 |
| Tin (Sn), % | 34.5 to 35.5 | |
| 24.5 to 25.5 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 to 0.0010 |