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Solder Alloy 115 vs. Nickel 200

Solder alloy 115 belongs to the otherwise unclassified metals classification, while nickel 200 belongs to the nickel alloys. There are 24 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is nickel 200.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
180
Elongation at Break, % 22
23 to 44
Poisson's Ratio 0.41
0.31
Shear Modulus, GPa 10
70
Tensile Strength: Ultimate (UTS), MPa 36
420 to 540

Thermal Properties

Latent Heat of Fusion, J/g 36
290
Melting Completion (Liquidus), °C 250
1460
Melting Onset (Solidus), °C 180
1440
Specific Heat Capacity, J/kg-K 160
450
Thermal Conductivity, W/m-K 43
69
Thermal Expansion, µm/m-K 27
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
18
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
18

Otherwise Unclassified Properties

Base Metal Price, % relative 95
65
Density, g/cm3 9.9
8.9
Embodied Carbon, kg CO2/kg material 7.8
11
Embodied Energy, MJ/kg 130
150
Embodied Water, L/kg 730
230

Common Calculations

Stiffness to Weight: Axial, points 1.6
11
Stiffness to Weight: Bending, points 10
21
Strength to Weight: Axial, points 1.0
13 to 17
Strength to Weight: Bending, points 2.4
14 to 17
Thermal Diffusivity, mm2/s 27
17
Thermal Shock Resistance, points 3.4
13 to 16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 0 to 0.080
0 to 0.25
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 63.4 to 65.5
0
Manganese (Mn), % 0
0 to 0.35
Nickel (Ni), % 0 to 0.010
99 to 100
Silicon (Si), % 0
0 to 0.35
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0