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Solder Alloy 115 vs. C70400 Copper-nickel

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C70400 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C70400 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
120
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 10
45
Tensile Strength: Ultimate (UTS), MPa 36
300 to 310

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1120
Melting Onset (Solidus), °C 180
1060
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 43
64
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
14
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
14

Otherwise Unclassified Properties

Base Metal Price, % relative 95
32
Density, g/cm3 9.9
8.9
Embodied Carbon, kg CO2/kg material 7.8
3.0
Embodied Energy, MJ/kg 130
47
Embodied Water, L/kg 730
300

Common Calculations

Stiffness to Weight: Axial, points 1.6
7.5
Stiffness to Weight: Bending, points 10
19
Strength to Weight: Axial, points 1.0
9.3 to 9.8
Strength to Weight: Bending, points 2.4
11 to 12
Thermal Diffusivity, mm2/s 27
18
Thermal Shock Resistance, points 3.4
10 to 11

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
89.8 to 93.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.3 to 1.7
Lead (Pb), % 63.4 to 65.5
0 to 0.050
Manganese (Mn), % 0
0.3 to 0.8
Nickel (Ni), % 0 to 0.010
4.8 to 6.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5