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Solder Alloy 115 vs. C71500 Copper-nickel

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C71500 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
140
Poisson's Ratio 0.41
0.33
Shear Modulus, GPa 10
52
Tensile Strength: Ultimate (UTS), MPa 36
380 to 620

Thermal Properties

Latent Heat of Fusion, J/g 36
230
Melting Completion (Liquidus), °C 250
1240
Melting Onset (Solidus), °C 180
1170
Specific Heat Capacity, J/kg-K 160
400
Thermal Conductivity, W/m-K 43
28
Thermal Expansion, µm/m-K 27
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
4.7

Otherwise Unclassified Properties

Base Metal Price, % relative 95
41
Density, g/cm3 9.9
8.9
Embodied Carbon, kg CO2/kg material 7.8
5.1
Embodied Energy, MJ/kg 130
74
Embodied Water, L/kg 730
280

Common Calculations

Stiffness to Weight: Axial, points 1.6
8.6
Stiffness to Weight: Bending, points 10
19
Strength to Weight: Axial, points 1.0
12 to 19
Strength to Weight: Bending, points 2.4
13 to 18
Thermal Diffusivity, mm2/s 27
7.7
Thermal Shock Resistance, points 3.4
12 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
63.5 to 70.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.4 to 1.0
Lead (Pb), % 63.4 to 65.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
29 to 33
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5