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Solder Alloy 115 vs. C73500 Nickel Silver

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C73500 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C73500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
130
Poisson's Ratio 0.41
0.33
Shear Modulus, GPa 10
47
Tensile Strength: Ultimate (UTS), MPa 36
380 to 580

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1140
Melting Onset (Solidus), °C 180
1090
Specific Heat Capacity, J/kg-K 160
400
Thermal Conductivity, W/m-K 43
36
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
6.7

Otherwise Unclassified Properties

Base Metal Price, % relative 95
35
Density, g/cm3 9.9
8.7
Embodied Carbon, kg CO2/kg material 7.8
4.0
Embodied Energy, MJ/kg 130
61
Embodied Water, L/kg 730
300

Common Calculations

Stiffness to Weight: Axial, points 1.6
8.0
Stiffness to Weight: Bending, points 10
19
Strength to Weight: Axial, points 1.0
12 to 19
Strength to Weight: Bending, points 2.4
13 to 18
Thermal Diffusivity, mm2/s 27
10
Thermal Shock Resistance, points 3.4
13 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
70.5 to 73.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 63.4 to 65.5
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
16.5 to 19.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
5.7 to 13
Residuals, % 0
0 to 0.5