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Solder Alloy 115 vs. C74500 Nickel Silver

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C74500 nickel silver belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C74500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
120
Elongation at Break, % 22
3.0 to 24
Poisson's Ratio 0.41
0.32
Shear Modulus, GPa 10
44
Tensile Strength: Ultimate (UTS), MPa 36
390 to 700

Thermal Properties

Latent Heat of Fusion, J/g 36
190
Melting Completion (Liquidus), °C 250
1020
Melting Onset (Solidus), °C 180
970
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 43
45
Thermal Expansion, µm/m-K 27
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
9.7

Otherwise Unclassified Properties

Base Metal Price, % relative 95
29
Density, g/cm3 9.9
8.3
Embodied Carbon, kg CO2/kg material 7.8
3.4
Embodied Energy, MJ/kg 130
54
Embodied Water, L/kg 730
310

Common Calculations

Stiffness to Weight: Axial, points 1.6
7.7
Stiffness to Weight: Bending, points 10
19
Strength to Weight: Axial, points 1.0
13 to 23
Strength to Weight: Bending, points 2.4
14 to 21
Thermal Diffusivity, mm2/s 27
14
Thermal Shock Resistance, points 3.4
13 to 23

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
63.5 to 66.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 63.4 to 65.5
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
9.0 to 11
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
21.2 to 27.5
Residuals, % 0
0 to 0.5