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Solder Alloy 115 vs. C76200 Nickel Silver

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C76200 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C76200 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
120
Poisson's Ratio 0.41
0.31
Shear Modulus, GPa 10
44
Tensile Strength: Ultimate (UTS), MPa 36
390 to 790

Thermal Properties

Latent Heat of Fusion, J/g 36
190
Melting Completion (Liquidus), °C 250
1030
Melting Onset (Solidus), °C 180
980
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 43
45
Thermal Expansion, µm/m-K 27
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
9.8

Otherwise Unclassified Properties

Base Metal Price, % relative 95
29
Density, g/cm3 9.9
8.2
Embodied Carbon, kg CO2/kg material 7.8
3.6
Embodied Energy, MJ/kg 130
57
Embodied Water, L/kg 730
310

Common Calculations

Stiffness to Weight: Axial, points 1.6
7.8
Stiffness to Weight: Bending, points 10
20
Strength to Weight: Axial, points 1.0
13 to 27
Strength to Weight: Bending, points 2.4
14 to 23
Thermal Diffusivity, mm2/s 27
14
Thermal Shock Resistance, points 3.4
13 to 26

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
57 to 61
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 63.4 to 65.5
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
11 to 13.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
24.2 to 32
Residuals, % 0
0 to 0.5