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Solder Alloy 115 vs. C81500 Copper

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C81500 copper belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C81500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
110
Elastic (Young's, Tensile) Modulus, GPa 28
120
Elongation at Break, % 22
17
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 10
44
Tensile Strength: Ultimate (UTS), MPa 36
350

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1090
Melting Onset (Solidus), °C 180
1080
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 43
320
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
82
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
83

Otherwise Unclassified Properties

Base Metal Price, % relative 95
31
Density, g/cm3 9.9
8.9
Embodied Carbon, kg CO2/kg material 7.8
2.6
Embodied Energy, MJ/kg 130
41
Embodied Water, L/kg 730
310

Common Calculations

Stiffness to Weight: Axial, points 1.6
7.3
Stiffness to Weight: Bending, points 10
18
Strength to Weight: Axial, points 1.0
11
Strength to Weight: Bending, points 2.4
12
Thermal Diffusivity, mm2/s 27
91
Thermal Shock Resistance, points 3.4
12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Chromium (Cr), % 0
0.4 to 1.5
Copper (Cu), % 0 to 0.080
97.4 to 99.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 63.4 to 65.5
0 to 0.020
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0 to 0.1
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5