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Solder Alloy 116 vs. ASTM B540 Palladium

Both solder alloy 116 and ASTM B540 palladium are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (13, in this case) are not shown.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is ASTM B540 palladium.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 26
110
Elongation at Break, % 18
1.1 to 14
Poisson's Ratio 0.42
0.38
Shear Modulus, GPa 9.3
39
Tensile Strength: Ultimate (UTS), MPa 34
830 to 1240

Thermal Properties

Latent Heat of Fusion, J/g 34
140
Melting Completion (Liquidus), °C 260
1220
Melting Onset (Solidus), °C 180
1020
Specific Heat Capacity, J/kg-K 160
240
Thermal Expansion, µm/m-K 27
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
4.9 to 5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
3.5 to 3.9

Otherwise Unclassified Properties

Density, g/cm3 10
13

Common Calculations

Stiffness to Weight: Axial, points 1.5
4.7
Stiffness to Weight: Bending, points 9.8
12
Strength to Weight: Axial, points 0.94
18 to 27
Strength to Weight: Bending, points 2.3
15 to 20
Thermal Shock Resistance, points 3.4
41 to 61

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
13.5 to 14.5
Gold (Au), % 0 to 0.050
9.5 to 10.5
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 68.4 to 70.5
0
Nickel (Ni), % 0 to 0.010
0
Palladium (Pd), % 0
34 to 36
Platinum (Pt), % 0
9.5 to 10.5
Silver (Ag), % 0 to 0.1
29 to 31
Tin (Sn), % 29.5 to 30.5
0
Zinc (Zn), % 0 to 0.0010
0.8 to 1.2
Residuals, % 0
0 to 0.3