Solder Alloy 116 vs. ASTM B596 Au-Cu
Both solder alloy 116 and ASTM B596 Au-Cu are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is solder alloy 116 and the bottom bar is ASTM B596 Au-Cu.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 26 | |
100 |
Elongation at Break, % | 18 | |
4.3 to 17 |
Poisson's Ratio | 0.42 | |
0.41 |
Shear Modulus, GPa | 9.3 | |
36 |
Tensile Strength: Ultimate (UTS), MPa | 34 | |
450 to 620 |
Thermal Properties
Latent Heat of Fusion, J/g | 34 | |
77 |
Melting Completion (Liquidus), °C | 260 | |
1060 |
Melting Onset (Solidus), °C | 180 | |
930 |
Specific Heat Capacity, J/kg-K | 160 | |
150 |
Thermal Expansion, µm/m-K | 27 | |
14 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 9.3 | |
14 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 8.3 | |
6.7 |
Otherwise Unclassified Properties
Density, g/cm3 | 10 | |
18 |
Common Calculations
Stiffness to Weight: Axial, points | 1.5 | |
3.1 |
Stiffness to Weight: Bending, points | 9.8 | |
8.5 |
Strength to Weight: Axial, points | 0.94 | |
6.8 to 9.4 |
Strength to Weight: Bending, points | 2.3 | |
7.1 to 8.8 |
Thermal Shock Resistance, points | 3.4 | |
22 to 30 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 |
Antimony (Sb), % | 0 to 0.5 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.25 | |
0 |
Cadmium (Cd), % | 0 to 0.0050 | |
0 |
Copper (Cu), % | 0 to 0.080 | |
9.0 to 11 |
Gold (Au), % | 0 to 0.050 | |
89 to 91 |
Indium (In), % | 0 to 0.1 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0 |
Lead (Pb), % | 68.4 to 70.5 | |
0 |
Nickel (Ni), % | 0 to 0.010 | |
0 |
Silver (Ag), % | 0 to 0.1 | |
0 |
Tin (Sn), % | 29.5 to 30.5 | |
0 |
Zinc (Zn), % | 0 to 0.0010 | |
0 |
Residuals, % | 0 | |
0 to 0.4 |