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Solder Alloy 116 vs. C10500 Copper

Solder alloy 116 belongs to the otherwise unclassified metals classification, while C10500 copper belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is C10500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 26
120
Elongation at Break, % 18
2.8 to 51
Poisson's Ratio 0.42
0.34
Shear Modulus, GPa 9.3
43
Tensile Strength: Ultimate (UTS), MPa 34
220 to 400

Thermal Properties

Latent Heat of Fusion, J/g 34
210
Melting Completion (Liquidus), °C 260
1080
Melting Onset (Solidus), °C 180
1080
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 41
390
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
100
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
100

Otherwise Unclassified Properties

Base Metal Price, % relative 90
32
Density, g/cm3 10
9.0
Embodied Carbon, kg CO2/kg material 7.2
2.6
Embodied Energy, MJ/kg 120
42
Embodied Water, L/kg 690
350

Common Calculations

Stiffness to Weight: Axial, points 1.5
7.2
Stiffness to Weight: Bending, points 9.8
18
Strength to Weight: Axial, points 0.94
6.8 to 12
Strength to Weight: Bending, points 2.3
9.1 to 14
Thermal Diffusivity, mm2/s 26
110
Thermal Shock Resistance, points 3.4
7.8 to 14

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
99.89 to 99.966
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 68.4 to 70.5
0
Nickel (Ni), % 0 to 0.010
0
Oxygen (O), % 0
0 to 0.0010
Silver (Ag), % 0 to 0.1
0.034 to 0.060
Tin (Sn), % 29.5 to 30.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.050