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Solder Alloy 117 vs. CC383H Copper-nickel

Solder alloy 117 belongs to the otherwise unclassified metals classification, while CC383H copper-nickel belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is solder alloy 117 and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 11
130
Elastic (Young's, Tensile) Modulus, GPa 23
140
Elongation at Break, % 20
20
Poisson's Ratio 0.42
0.33
Shear Modulus, GPa 8.1
52
Tensile Strength: Ultimate (UTS), MPa 33
490

Thermal Properties

Latent Heat of Fusion, J/g 31
240
Melting Completion (Liquidus), °C 280
1180
Melting Onset (Solidus), °C 180
1130
Specific Heat Capacity, J/kg-K 150
410
Thermal Conductivity, W/m-K 37
29
Thermal Expansion, µm/m-K 28
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.7
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 7.5
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 85
44
Density, g/cm3 11
8.9
Embodied Carbon, kg CO2/kg material 6.1
5.7
Embodied Energy, MJ/kg 100
83
Embodied Water, L/kg 610
280

Common Calculations

Stiffness to Weight: Axial, points 1.2
8.6
Stiffness to Weight: Bending, points 9.0
19
Strength to Weight: Axial, points 0.88
15
Strength to Weight: Bending, points 2.2
16
Thermal Diffusivity, mm2/s 24
8.1
Thermal Shock Resistance, points 3.7
17

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0 to 0.0050
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 0 to 0.080
64 to 69.1
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.5
Lead (Pb), % 78.4 to 80.5
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0 to 0.010
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 19.5 to 20.5
0
Zinc (Zn), % 0 to 0.0010
0 to 0.5