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Solder Alloy 123 vs. C55283 Copper

Solder alloy 123 belongs to the otherwise unclassified metals classification, while C55283 copper belongs to the copper alloys. There are 17 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is C55283 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
100
Poisson's Ratio 0.44
0.34
Shear Modulus, GPa 6.2
39
Tensile Strength: Ultimate (UTS), MPa 28
190

Thermal Properties

Latent Heat of Fusion, J/g 26
190
Melting Completion (Liquidus), °C 310
720
Melting Onset (Solidus), °C 300
640
Specific Heat Capacity, J/kg-K 130
400
Thermal Expansion, µm/m-K 29
16

Otherwise Unclassified Properties

Density, g/cm3 11
8.6
Embodied Carbon, kg CO2/kg material 4.5
7.9
Embodied Energy, MJ/kg 74
120

Common Calculations

Stiffness to Weight: Axial, points 0.9
6.8
Stiffness to Weight: Bending, points 7.8
18
Strength to Weight: Axial, points 0.69
6.1
Strength to Weight: Bending, points 1.8
8.5
Thermal Shock Resistance, points 3.8
8.0

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
86.2 to 87.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 93.5 to 95.5
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
7.0 to 7.5
Silver (Ag), % 0 to 0.1
5.8 to 6.2
Tin (Sn), % 4.5 to 5.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15