Solder Alloy 123 vs. C70250 Copper
Solder alloy 123 belongs to the otherwise unclassified metals classification, while C70250 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.
For each property being compared, the top bar is solder alloy 123 and the bottom bar is C70250 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 18 | |
| 120 |
| Poisson's Ratio | 0.44 | |
| 0.34 |
| Shear Modulus, GPa | 6.2 | |
| 44 |
| Tensile Strength: Ultimate (UTS), MPa | 28 | |
| 520 to 740 |
Thermal Properties
| Latent Heat of Fusion, J/g | 26 | |
| 220 |
| Melting Completion (Liquidus), °C | 310 | |
| 1100 |
| Melting Onset (Solidus), °C | 300 | |
| 1080 |
| Specific Heat Capacity, J/kg-K | 130 | |
| 390 |
| Thermal Conductivity, W/m-K | 23 | |
| 170 |
| Thermal Expansion, µm/m-K | 29 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 8.8 | |
| 36 to 50 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 7.1 | |
| 37 to 51 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 75 | |
| 31 |
| Density, g/cm3 | 11 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 4.5 | |
| 2.9 |
| Embodied Energy, MJ/kg | 74 | |
| 45 |
| Embodied Water, L/kg | 500 | |
| 310 |
Common Calculations
| Stiffness to Weight: Axial, points | 0.9 | |
| 7.4 |
| Stiffness to Weight: Bending, points | 7.8 | |
| 18 |
| Strength to Weight: Axial, points | 0.69 | |
| 16 to 23 |
| Strength to Weight: Bending, points | 1.8 | |
| 16 to 21 |
| Thermal Diffusivity, mm2/s | 16 | |
| 49 |
| Thermal Shock Resistance, points | 3.8 | |
| 18 to 26 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.5 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0050 | |
| 0 |
| Copper (Cu), % | 0 to 0.080 | |
| 92.7 to 97.5 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 |
| Lead (Pb), % | 93.5 to 95.5 | |
| 0 to 0.050 |
| Magnesium (Mg), % | 0 | |
| 0.050 to 0.3 |
| Manganese (Mn), % | 0 | |
| 0 to 0.1 |
| Nickel (Ni), % | 0 to 0.010 | |
| 2.2 to 4.2 |
| Silicon (Si), % | 0 | |
| 0.25 to 1.2 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 4.5 to 5.5 | |
| 0 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 to 1.0 |
| Residuals, % | 0 | |
| 0 to 0.5 |