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Solder Alloy 123 vs. C71500 Copper-nickel

Solder alloy 123 belongs to the otherwise unclassified metals classification, while C71500 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
140
Poisson's Ratio 0.44
0.33
Shear Modulus, GPa 6.2
52
Tensile Strength: Ultimate (UTS), MPa 28
380 to 620

Thermal Properties

Latent Heat of Fusion, J/g 26
230
Melting Completion (Liquidus), °C 310
1240
Melting Onset (Solidus), °C 300
1170
Specific Heat Capacity, J/kg-K 130
400
Thermal Conductivity, W/m-K 23
28
Thermal Expansion, µm/m-K 29
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
4.7

Otherwise Unclassified Properties

Base Metal Price, % relative 75
41
Density, g/cm3 11
8.9
Embodied Carbon, kg CO2/kg material 4.5
5.1
Embodied Energy, MJ/kg 74
74
Embodied Water, L/kg 500
280

Common Calculations

Stiffness to Weight: Axial, points 0.9
8.6
Stiffness to Weight: Bending, points 7.8
19
Strength to Weight: Axial, points 0.69
12 to 19
Strength to Weight: Bending, points 1.8
13 to 18
Thermal Diffusivity, mm2/s 16
7.7
Thermal Shock Resistance, points 3.8
12 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
63.5 to 70.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.4 to 1.0
Lead (Pb), % 93.5 to 95.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
29 to 33
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 4.5 to 5.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5