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Solder Alloy 135 vs. CC383H Copper-nickel

Solder alloy 135 belongs to the otherwise unclassified metals classification, while CC383H copper-nickel belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 135 and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 27
140
Elongation at Break, % 20
20
Poisson's Ratio 0.41
0.33
Shear Modulus, GPa 9.5
52
Tensile Strength: Ultimate (UTS), MPa 35
490

Thermal Properties

Latent Heat of Fusion, J/g 36
240
Melting Completion (Liquidus), °C 250
1180
Melting Onset (Solidus), °C 190
1130
Specific Heat Capacity, J/kg-K 160
410
Thermal Conductivity, W/m-K 42
29
Thermal Expansion, µm/m-K 27
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.5
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 8.5
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 90
44
Density, g/cm3 10
8.9
Embodied Carbon, kg CO2/kg material 7.3
5.7
Embodied Energy, MJ/kg 120
83
Embodied Water, L/kg 720
280

Common Calculations

Stiffness to Weight: Axial, points 1.5
8.6
Stiffness to Weight: Bending, points 9.9
19
Strength to Weight: Axial, points 1.0
15
Strength to Weight: Bending, points 2.4
16
Thermal Diffusivity, mm2/s 27
8.1
Thermal Shock Resistance, points 3.5
17

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0.5 to 1.8
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0 to 0.0050
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 0 to 0.080
64 to 69.1
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.5
Lead (Pb), % 67.1 to 70
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0 to 0.010
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 29.5 to 30.5
0
Zinc (Zn), % 0 to 0.0010
0 to 0.5