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Solder Alloy 135 vs. C11300 Copper

Solder alloy 135 belongs to the otherwise unclassified metals classification, while C11300 copper belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 135 and the bottom bar is C11300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 27
120
Elongation at Break, % 20
2.3 to 50
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 9.5
43
Tensile Strength: Ultimate (UTS), MPa 35
230 to 410

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1080
Melting Onset (Solidus), °C 190
1030
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 42
390
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.5
100
Electrical Conductivity: Equal Weight (Specific), % IACS 8.5
100

Otherwise Unclassified Properties

Base Metal Price, % relative 90
32
Density, g/cm3 10
9.0
Embodied Carbon, kg CO2/kg material 7.3
2.6
Embodied Energy, MJ/kg 120
42
Embodied Water, L/kg 720
340

Common Calculations

Stiffness to Weight: Axial, points 1.5
7.2
Stiffness to Weight: Bending, points 9.9
18
Strength to Weight: Axial, points 1.0
7.2 to 13
Strength to Weight: Bending, points 2.4
9.4 to 14
Thermal Diffusivity, mm2/s 27
110
Thermal Shock Resistance, points 3.5
8.2 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0.5 to 1.8
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
99.85 to 99.973
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 67.1 to 70
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0.027 to 0.050
Tin (Sn), % 29.5 to 30.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.1