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Solder Alloy 135 vs. C72800 Copper-nickel

Solder alloy 135 belongs to the otherwise unclassified metals classification, while C72800 copper-nickel belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 135 and the bottom bar is C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 27
120
Elongation at Break, % 20
3.9 to 23
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 9.5
44
Tensile Strength: Ultimate (UTS), MPa 35
520 to 1270

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1080
Melting Onset (Solidus), °C 190
920
Specific Heat Capacity, J/kg-K 160
380
Thermal Conductivity, W/m-K 42
55
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.5
11
Electrical Conductivity: Equal Weight (Specific), % IACS 8.5
11

Otherwise Unclassified Properties

Base Metal Price, % relative 90
38
Density, g/cm3 10
8.8
Embodied Carbon, kg CO2/kg material 7.3
4.4
Embodied Energy, MJ/kg 120
68
Embodied Water, L/kg 720
360

Common Calculations

Stiffness to Weight: Axial, points 1.5
7.4
Stiffness to Weight: Bending, points 9.9
19
Strength to Weight: Axial, points 1.0
17 to 40
Strength to Weight: Bending, points 2.4
16 to 30
Thermal Diffusivity, mm2/s 27
17
Thermal Shock Resistance, points 3.5
19 to 45

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0.5 to 1.8
0 to 0.020
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
78.3 to 82.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 67.1 to 70
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0 to 0.010
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0
0 to 0.0050
Silicon (Si), % 0
0 to 0.050
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 29.5 to 30.5
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.3