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Solder Alloy 151 vs. C81500 Copper

Solder alloy 151 belongs to the otherwise unclassified metals classification, while C81500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 151 and the bottom bar is C81500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 39
120
Elongation at Break, % 37
17
Poisson's Ratio 0.37
0.34
Shear Modulus, GPa 14
44
Tensile Strength: Ultimate (UTS), MPa 46
350

Thermal Properties

Latent Heat of Fusion, J/g 47
210
Melting Completion (Liquidus), °C 150
1090
Melting Onset (Solidus), °C 150
1080
Specific Heat Capacity, J/kg-K 190
390
Thermal Conductivity, W/m-K 44
320
Thermal Expansion, µm/m-K 26
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
82
Electrical Conductivity: Equal Weight (Specific), % IACS 10
83

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.2
2.6
Embodied Energy, MJ/kg 160
41
Embodied Water, L/kg 920
310

Common Calculations

Stiffness to Weight: Axial, points 2.5
7.3
Stiffness to Weight: Bending, points 13
18
Strength to Weight: Axial, points 1.4
11
Strength to Weight: Bending, points 3.2
12
Thermal Diffusivity, mm2/s 26
91
Thermal Shock Resistance, points 3.2
12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 17.5 to 18.5
0
Chromium (Cr), % 0
0.4 to 1.5
Copper (Cu), % 0 to 0.080
97.4 to 99.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 30.3 to 33
0 to 0.020
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 49.5 to 50.5
0 to 0.1
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5