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Solder Alloy 161 vs. C72800 Copper-nickel

Solder alloy 161 belongs to the otherwise unclassified metals classification, while C72800 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 161 and the bottom bar is C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 38
120
Elongation at Break, % 44
3.9 to 23
Poisson's Ratio 0.39
0.34
Shear Modulus, GPa 14
44
Tensile Strength: Ultimate (UTS), MPa 53
520 to 1270

Thermal Properties

Latent Heat of Fusion, J/g 48
210
Melting Completion (Liquidus), °C 190
1080
Melting Onset (Solidus), °C 180
920
Specific Heat Capacity, J/kg-K 190
380
Thermal Conductivity, W/m-K 49
55
Thermal Expansion, µm/m-K 25
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
11
Electrical Conductivity: Equal Weight (Specific), % IACS 11
11

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 11
4.4
Embodied Energy, MJ/kg 180
68
Embodied Water, L/kg 910
360

Common Calculations

Stiffness to Weight: Axial, points 2.4
7.4
Stiffness to Weight: Bending, points 13
19
Strength to Weight: Axial, points 1.7
17 to 40
Strength to Weight: Bending, points 3.5
16 to 30
Thermal Diffusivity, mm2/s 29
17
Thermal Shock Resistance, points 4.1
19 to 45

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.2
0 to 0.020
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 1.2 to 1.6
78.3 to 82.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 37.3 to 39.3
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0 to 0.010
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0
0 to 0.0050
Silicon (Si), % 0
0 to 0.050
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 59.5 to 60.5
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.3