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Solder Alloy 162 vs. C72500 Copper-nickel

Solder alloy 162 belongs to the otherwise unclassified metals classification, while C72500 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 162 and the bottom bar is C72500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 35
120
Poisson's Ratio 0.4
0.34
Shear Modulus, GPa 12
45
Tensile Strength: Ultimate (UTS), MPa 41
420 to 780

Thermal Properties

Latent Heat of Fusion, J/g 44
210
Melting Completion (Liquidus), °C 220
1130
Melting Onset (Solidus), °C 180
1060
Specific Heat Capacity, J/kg-K 180
390
Thermal Conductivity, W/m-K 47
54
Thermal Expansion, µm/m-K 25
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
11
Electrical Conductivity: Equal Weight (Specific), % IACS 10
11

Otherwise Unclassified Properties

Density, g/cm3 9.3
8.9
Embodied Carbon, kg CO2/kg material 9.4
3.6
Embodied Energy, MJ/kg 160
55
Embodied Water, L/kg 830
320

Common Calculations

Stiffness to Weight: Axial, points 2.1
7.6
Stiffness to Weight: Bending, points 12
19
Strength to Weight: Axial, points 1.2
13 to 24
Strength to Weight: Bending, points 2.8
14 to 21
Thermal Diffusivity, mm2/s 28
16
Thermal Shock Resistance, points 3.3
14 to 27

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 1.2 to 1.6
85.2 to 89.7
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.6
Lead (Pb), % 47.3 to 49.3
0 to 0.050
Manganese (Mn), % 0
0 to 0.2
Nickel (Ni), % 0 to 0.010
8.5 to 10.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 49.5 to 50.5
1.8 to 2.8
Zinc (Zn), % 0 to 0.0010
0 to 0.5
Residuals, % 0
0 to 0.2