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Solder Alloy 181 vs. Commercially Pure Palladium

Both solder alloy 181 and commercially pure palladium are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 181 and the bottom bar is commercially pure palladium.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
120
Elongation at Break, % 41
1.1 to 11
Poisson's Ratio 0.44
0.39
Shear Modulus, GPa 6.1
43
Tensile Strength: Ultimate (UTS), MPa 27
200 to 380

Thermal Properties

Latent Heat of Fusion, J/g 26
160
Melting Completion (Liquidus), °C 310
1550
Melting Onset (Solidus), °C 300
1550
Specific Heat Capacity, J/kg-K 130
240
Thermal Expansion, µm/m-K 29
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
16
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
12

Otherwise Unclassified Properties

Density, g/cm3 11
12

Common Calculations

Stiffness to Weight: Axial, points 0.86
5.6
Stiffness to Weight: Bending, points 7.7
14
Strength to Weight: Axial, points 0.66
4.5 to 8.8
Strength to Weight: Bending, points 1.8
6.2 to 9.7
Thermal Shock Resistance, points 3.8
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 96.2 to 98
0
Nickel (Ni), % 0 to 0.010
0
Palladium (Pd), % 0
99.8 to 100
Silver (Ag), % 2.0 to 3.0
0
Tin (Sn), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.2