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Solder Alloy 181 vs. C75700 Nickel Silver

Solder alloy 181 belongs to the otherwise unclassified metals classification, while C75700 nickel silver belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 181 and the bottom bar is C75700 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
120
Elongation at Break, % 41
3.2 to 22
Poisson's Ratio 0.44
0.32
Shear Modulus, GPa 6.1
45
Tensile Strength: Ultimate (UTS), MPa 27
590 to 610

Thermal Properties

Latent Heat of Fusion, J/g 26
200
Melting Completion (Liquidus), °C 310
1040
Melting Onset (Solidus), °C 300
990
Specific Heat Capacity, J/kg-K 130
390
Thermal Conductivity, W/m-K 24
40
Thermal Expansion, µm/m-K 29
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
8.0
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
8.6

Otherwise Unclassified Properties

Density, g/cm3 11
8.4
Embodied Carbon, kg CO2/kg material 6.2
3.6
Embodied Energy, MJ/kg 100
56

Common Calculations

Stiffness to Weight: Axial, points 0.86
7.8
Stiffness to Weight: Bending, points 7.7
19
Strength to Weight: Axial, points 0.66
19 to 20
Strength to Weight: Bending, points 1.8
19
Thermal Diffusivity, mm2/s 16
12
Thermal Shock Resistance, points 3.8
22 to 23

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
63.5 to 66.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 96.2 to 98
0 to 0.050
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
11 to 13
Silver (Ag), % 2.0 to 3.0
0
Tin (Sn), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.0010
19.2 to 25.5
Residuals, % 0
0 to 0.5