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Solder Alloy 182 vs. C75400 Nickel Silver

Solder alloy 182 belongs to the otherwise unclassified metals classification, while C75400 nickel silver belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 182 and the bottom bar is C75400 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 19
120
Elongation at Break, % 37
2.0 to 43
Poisson's Ratio 0.44
0.32
Shear Modulus, GPa 6.7
46
Tensile Strength: Ultimate (UTS), MPa 28
370 to 630

Thermal Properties

Latent Heat of Fusion, J/g 28
200
Melting Completion (Liquidus), °C 370
1080
Melting Onset (Solidus), °C 300
1040
Specific Heat Capacity, J/kg-K 130
390
Thermal Conductivity, W/m-K 27
36
Thermal Expansion, µm/m-K 29
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.6
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 7.6
7.4

Otherwise Unclassified Properties

Density, g/cm3 11
8.5
Embodied Carbon, kg CO2/kg material 9.0
3.8
Embodied Energy, MJ/kg 140
59

Common Calculations

Stiffness to Weight: Axial, points 0.95
7.9
Stiffness to Weight: Bending, points 7.9
19
Strength to Weight: Axial, points 0.69
12 to 21
Strength to Weight: Bending, points 1.8
13 to 19
Thermal Diffusivity, mm2/s 18
11
Thermal Shock Resistance, points 3.7
12 to 21

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
63.5 to 66.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 93.2 to 95
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
14 to 16
Silver (Ag), % 5.0 to 6.0
0
Tin (Sn), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.0010
16.2 to 22.5
Residuals, % 0
0 to 0.5