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Solder Alloy 191 vs. Solder Alloy 801

Both solder alloy 191 and solder alloy 801 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 22 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 191 and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 19
53
Elongation at Break, % 32
33
Poisson's Ratio 0.43
0.35
Shear Modulus, GPa 6.5
20
Tensile Strength: Ultimate (UTS), MPa 29
55

Thermal Properties

Latent Heat of Fusion, J/g 27
64
Melting Completion (Liquidus), °C 300
200
Melting Onset (Solidus), °C 300
200
Specific Heat Capacity, J/kg-K 130
240
Thermal Conductivity, W/m-K 24
61
Thermal Expansion, µm/m-K 29
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
15
Electrical Conductivity: Equal Weight (Specific), % IACS 7.2
19

Otherwise Unclassified Properties

Density, g/cm3 11
7.2
Embodied Carbon, kg CO2/kg material 5.8
14
Embodied Energy, MJ/kg 95
240

Common Calculations

Stiffness to Weight: Axial, points 0.93
4.1
Stiffness to Weight: Bending, points 8.0
17
Strength to Weight: Axial, points 0.72
2.1
Strength to Weight: Bending, points 1.9
4.4
Thermal Diffusivity, mm2/s 16
36
Thermal Shock Resistance, points 3.9
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.2
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 92.4 to 94
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 1.2 to 1.8
0 to 0.1
Tin (Sn), % 4.8 to 5.2
89.9 to 91.5
Zinc (Zn), % 0 to 0.0010
8.5 to 9.5