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Solder Alloy 191 vs. C17300 Copper

Solder alloy 191 belongs to the otherwise unclassified metals classification, while C17300 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 191 and the bottom bar is C17300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 19
120
Elongation at Break, % 32
3.0 to 23
Poisson's Ratio 0.43
0.33
Shear Modulus, GPa 6.5
45
Tensile Strength: Ultimate (UTS), MPa 29
500 to 1380

Thermal Properties

Latent Heat of Fusion, J/g 27
230
Melting Completion (Liquidus), °C 300
980
Melting Onset (Solidus), °C 300
870
Specific Heat Capacity, J/kg-K 130
380
Thermal Conductivity, W/m-K 24
110
Thermal Expansion, µm/m-K 29
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
22
Electrical Conductivity: Equal Weight (Specific), % IACS 7.2
23

Otherwise Unclassified Properties

Density, g/cm3 11
8.8
Embodied Carbon, kg CO2/kg material 5.8
9.4
Embodied Energy, MJ/kg 95
150

Common Calculations

Stiffness to Weight: Axial, points 0.93
7.6
Stiffness to Weight: Bending, points 8.0
19
Strength to Weight: Axial, points 0.72
16 to 44
Strength to Weight: Bending, points 1.9
16 to 31
Thermal Diffusivity, mm2/s 16
32
Thermal Shock Resistance, points 3.9
17 to 48

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.2
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
1.8 to 2.0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
95.5 to 97.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 92.4 to 94
0.2 to 0.6
Nickel (Ni), % 0 to 0.010
0.2 to 0.6
Silicon (Si), % 0
0 to 0.2
Silver (Ag), % 1.2 to 1.8
0
Tin (Sn), % 4.8 to 5.2
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.5