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Solder Alloy 201 vs. Solder Alloy 122

Both solder alloy 201 and solder alloy 122 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 24 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is solder alloy 122.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 13
10
Elastic (Young's, Tensile) Modulus, GPa 50
20
Elongation at Break, % 38
30
Poisson's Ratio 0.35
0.43
Shear Modulus, GPa 19
6.9
Tensile Strength: Ultimate (UTS), MPa 41
30

Thermal Properties

Latent Heat of Fusion, J/g 64
27
Melting Completion (Liquidus), °C 240
300
Melting Onset (Solidus), °C 240
270
Specific Heat Capacity, J/kg-K 220
140
Thermal Conductivity, W/m-K 28
25
Thermal Expansion, µm/m-K 21
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
8.9
Electrical Conductivity: Equal Weight (Specific), % IACS 15
7.3

Otherwise Unclassified Properties

Density, g/cm3 7.3
11
Embodied Carbon, kg CO2/kg material 15
5.0
Embodied Energy, MJ/kg 250
84
Embodied Water, L/kg 1320
540

Common Calculations

Stiffness to Weight: Axial, points 3.8
1.0
Stiffness to Weight: Bending, points 17
8.2
Strength to Weight: Axial, points 1.6
0.77
Strength to Weight: Bending, points 3.6
2.0
Thermal Diffusivity, mm2/s 17
17
Thermal Shock Resistance, points 2.7
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 4.5 to 5.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.25
Cadmium (Cd), % 0 to 0.0020
0 to 0.0050
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
88.4 to 90.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 94 to 95.5
9.5 to 10.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010