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Solder Alloy 201 vs. C16500 Copper

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C16500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
110
Elongation at Break, % 38
1.5 to 53
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 41
280 to 530

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 240
1070
Melting Onset (Solidus), °C 240
1010
Specific Heat Capacity, J/kg-K 220
380
Thermal Conductivity, W/m-K 28
250
Thermal Expansion, µm/m-K 21
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
60
Electrical Conductivity: Equal Weight (Specific), % IACS 15
61

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
2.6
Embodied Energy, MJ/kg 250
42
Embodied Water, L/kg 1320
320

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.1
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.6
8.6 to 17
Strength to Weight: Bending, points 3.6
11 to 16
Thermal Diffusivity, mm2/s 17
74
Thermal Shock Resistance, points 2.7
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0.6 to 1.0
Copper (Cu), % 0 to 0.050
97.8 to 98.9
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0.5 to 0.7
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.5