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Solder Alloy 201 vs. C55180 Copper

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C55180 copper belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C55180 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
110
Elongation at Break, % 38
20
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
41
Tensile Strength: Ultimate (UTS), MPa 41
200

Thermal Properties

Latent Heat of Fusion, J/g 64
200
Melting Completion (Liquidus), °C 240
920
Melting Onset (Solidus), °C 240
710
Specific Heat Capacity, J/kg-K 220
400
Thermal Conductivity, W/m-K 28
200
Thermal Expansion, µm/m-K 21
17

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.6
Embodied Carbon, kg CO2/kg material 15
2.5
Embodied Energy, MJ/kg 250
39
Embodied Water, L/kg 1320
290

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.1
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.6
6.4
Strength to Weight: Bending, points 3.6
8.8
Thermal Diffusivity, mm2/s 17
56
Thermal Shock Resistance, points 2.7
7.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
94.7 to 95.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
4.8 to 5.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15