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Solder Alloy 201 vs. C71000 Copper-nickel

Solder alloy 201 belongs to the otherwise unclassified metals classification, while C71000 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is C71000 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
130
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 19
49
Tensile Strength: Ultimate (UTS), MPa 41
320 to 560

Thermal Properties

Latent Heat of Fusion, J/g 64
230
Melting Completion (Liquidus), °C 240
1200
Melting Onset (Solidus), °C 240
1150
Specific Heat Capacity, J/kg-K 220
400
Thermal Conductivity, W/m-K 28
43
Thermal Expansion, µm/m-K 21
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 15
6.6

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
4.3
Embodied Energy, MJ/kg 250
63
Embodied Water, L/kg 1320
290

Common Calculations

Stiffness to Weight: Axial, points 3.8
8.2
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.6
10 to 18
Strength to Weight: Bending, points 3.6
12 to 17
Thermal Diffusivity, mm2/s 17
12
Thermal Shock Resistance, points 2.7
12 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
73.5 to 80.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.0
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
19 to 23
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5