Solder Alloy 301 vs. ASTM Grade HP Steel
Solder alloy 301 belongs to the otherwise unclassified metals classification, while ASTM grade HP steel belongs to the iron alloys. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is solder alloy 301 and the bottom bar is ASTM grade HP steel.
Metric UnitsUS Customary Units
Mechanical Properties
| Brinell Hardness | 23 | |
| 140 |
| Elastic (Young's, Tensile) Modulus, GPa | 40 | |
| 200 |
| Elongation at Break, % | 51 | |
| 5.1 |
| Poisson's Ratio | 0.34 | |
| 0.28 |
| Shear Modulus, GPa | 15 | |
| 78 |
| Tensile Strength: Ultimate (UTS), MPa | 55 | |
| 490 |
| Tensile Strength: Yield (Proof), MPa | 49 | |
| 260 |
Thermal Properties
| Latent Heat of Fusion, J/g | 55 | |
| 320 |
| Melting Completion (Liquidus), °C | 140 | |
| 1370 |
| Melting Onset (Solidus), °C | 140 | |
| 1330 |
| Specific Heat Capacity, J/kg-K | 160 | |
| 480 |
| Thermal Conductivity, W/m-K | 19 | |
| 12 |
| Thermal Expansion, µm/m-K | 14 | |
| 16 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.7 | |
| 7.9 |
| Embodied Carbon, kg CO2/kg material | 13 | |
| 5.8 |
| Embodied Energy, MJ/kg | 210 | |
| 82 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 27 | |
| 21 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 30 | |
| 170 |
| Stiffness to Weight: Axial, points | 2.5 | |
| 14 |
| Stiffness to Weight: Bending, points | 13 | |
| 25 |
| Strength to Weight: Axial, points | 1.8 | |
| 17 |
| Strength to Weight: Bending, points | 3.7 | |
| 17 |
| Thermal Diffusivity, mm2/s | 13 | |
| 3.2 |
| Thermal Shock Resistance, points | 7.2 | |
| 11 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 56.5 to 59 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Carbon (C), % | 0 | |
| 0.35 to 0.75 |
| Chromium (Cr), % | 0 | |
| 24 to 28 |
| Copper (Cu), % | 0 to 0.050 | |
| 0 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 29.2 to 42.7 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 |
| Manganese (Mn), % | 0 | |
| 0 to 2.0 |
| Molybdenum (Mo), % | 0 | |
| 0 to 0.5 |
| Nickel (Ni), % | 0 to 0.010 | |
| 33 to 37 |
| Phosphorus (P), % | 0 | |
| 0 to 0.040 |
| Silicon (Si), % | 0 | |
| 0 to 2.5 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Sulfur (S), % | 0 | |
| 0 to 0.040 |
| Tin (Sn), % | 41 to 43 | |
| 0 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 |