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Solder Alloy 301 vs. Class 1 Tungsten

Both solder alloy 301 and class 1 tungsten are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is class 1 tungsten.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 40
250
Elongation at Break, % 51
5.7
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 15
98
Tensile Strength: Ultimate (UTS), MPa 55
860
Tensile Strength: Yield (Proof), MPa 49
580

Thermal Properties

Latent Heat of Fusion, J/g 55
160
Specific Heat Capacity, J/kg-K 160
120
Thermal Conductivity, W/m-K 19
21
Thermal Expansion, µm/m-K 14
5.1

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
12
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
7.4

Otherwise Unclassified Properties

Density, g/cm3 8.7
15
Embodied Carbon, kg CO2/kg material 13
22
Embodied Energy, MJ/kg 210
340

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 27
44
Resilience: Unit (Modulus of Resilience), kJ/m3 30
660
Stiffness to Weight: Axial, points 2.5
9.6
Stiffness to Weight: Bending, points 13
14
Strength to Weight: Axial, points 1.8
16
Strength to Weight: Bending, points 3.7
14
Thermal Diffusivity, mm2/s 13
12
Thermal Shock Resistance, points 7.2
48

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 56.5 to 59
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 41 to 43
0
Tungsten (W), % 0
90
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
10