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Solder Alloy 301 vs. Grade 1 Babbitt Metal

Both solder alloy 301 and grade 1 Babbitt Metal are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 42% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is grade 1 Babbitt Metal.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 23
13
Elastic (Young's, Tensile) Modulus, GPa 40
53
Elongation at Break, % 51
34
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 15
20
Tensile Strength: Yield (Proof), MPa 49
30

Thermal Properties

Latent Heat of Fusion, J/g 55
70
Melting Completion (Liquidus), °C 140
370
Melting Onset (Solidus), °C 140
220
Specific Heat Capacity, J/kg-K 160
230
Thermal Conductivity, W/m-K 19
45
Thermal Expansion, µm/m-K 14
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
13
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
16

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.3
Embodied Carbon, kg CO2/kg material 13
12
Embodied Energy, MJ/kg 210
200

Common Calculations

Resilience: Unit (Modulus of Resilience), kJ/m3 30
8.6
Stiffness to Weight: Axial, points 2.5
4.0
Stiffness to Weight: Bending, points 13
17
Thermal Diffusivity, mm2/s 13
26

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0050
Antimony (Sb), % 0 to 0.1
4.0 to 5.0
Arsenic (As), % 0 to 0.030
0 to 0.1
Bismuth (Bi), % 56.5 to 59
0 to 0.080
Cadmium (Cd), % 0 to 0.0020
0 to 0.050
Copper (Cu), % 0 to 0.050
4.0 to 5.0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.080
Lead (Pb), % 0 to 0.070
0 to 0.35
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 41 to 43
89.3 to 92
Zinc (Zn), % 0 to 0.0010
0 to 0.0050