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Solder Alloy 301 vs. Solder Alloy 121

Both solder alloy 301 and solder alloy 121 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is solder alloy 121.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 23
11
Elastic (Young's, Tensile) Modulus, GPa 40
21
Elongation at Break, % 51
25
Poisson's Ratio 0.34
0.43
Shear Modulus, GPa 15
7.5
Tensile Strength: Ultimate (UTS), MPa 55
32

Thermal Properties

Latent Heat of Fusion, J/g 55
29
Melting Completion (Liquidus), °C 140
290
Melting Onset (Solidus), °C 140
230
Specific Heat Capacity, J/kg-K 160
140
Thermal Conductivity, W/m-K 19
31
Thermal Expansion, µm/m-K 14
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
7.4

Otherwise Unclassified Properties

Density, g/cm3 8.7
11
Embodied Carbon, kg CO2/kg material 13
5.6
Embodied Energy, MJ/kg 210
93

Common Calculations

Stiffness to Weight: Axial, points 2.5
1.1
Stiffness to Weight: Bending, points 13
8.6
Strength to Weight: Axial, points 1.8
0.84
Strength to Weight: Bending, points 3.7
2.1
Thermal Diffusivity, mm2/s 13
20
Thermal Shock Resistance, points 7.2
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 56.5 to 59
0 to 0.25
Cadmium (Cd), % 0 to 0.0020
0 to 0.0050
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
83.4 to 85.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 41 to 43
14.5 to 15.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010