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Solder Alloy 301 vs. C11100 Copper

Solder alloy 301 belongs to the otherwise unclassified metals classification, while C11100 copper belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 301 and the bottom bar is C11100 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 40
120
Elongation at Break, % 51
1.5
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 15
44
Tensile Strength: Ultimate (UTS), MPa 55
460
Tensile Strength: Yield (Proof), MPa 49
420

Thermal Properties

Latent Heat of Fusion, J/g 55
210
Melting Completion (Liquidus), °C 140
1080
Melting Onset (Solidus), °C 140
1070
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 19
390
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.7
100
Electrical Conductivity: Equal Weight (Specific), % IACS 4.9
100

Otherwise Unclassified Properties

Density, g/cm3 8.7
9.0
Embodied Carbon, kg CO2/kg material 13
2.6
Embodied Energy, MJ/kg 210
41

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 27
6.6
Resilience: Unit (Modulus of Resilience), kJ/m3 30
750
Stiffness to Weight: Axial, points 2.5
7.2
Stiffness to Weight: Bending, points 13
18
Strength to Weight: Axial, points 1.8
14
Strength to Weight: Bending, points 3.7
15
Thermal Diffusivity, mm2/s 13
110
Thermal Shock Resistance, points 7.2
16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 56.5 to 59
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.9 to 100
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 41 to 43
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.1